▎ 摘　　要

NOVELTY - Producing a maleimide resin film involves applying a maleimide composition which is a fluid to form the shape of a film. The maleimide composition comprises maleimide (I), a (meth)acrylate having not less than 10 carbon atoms, 70-90 wt.% inorganic particles with respect to the whole resin film, a curing catalyst, and (e) an organic solvent. The organic solvent is volatilized from the maleimide composition to obtain the maleimide resin film which is a solid and uncured resin film. USE - Method for producing maleimide resin film used in flexible printed-wiring boards. ADVANTAGE - The method helps in preparing a maleimide resin film highly filled with inorganic particles, and having a sufficient adhesion force. The maleimide resin film is useful for many purposes, as it serves as a resin film that may have various functions depending on the properties of the inorganic particles, for example, when the inorganic particles used do not possess electric conductivity, the film is useful as an adhesive resin film having a low dielectric property. DETAILED DESCRIPTION - Producing a maleimide resin film involves applying a maleimide composition which is a fluid to form the shape of a film. The maleimide composition comprises (a) a maleimide of formula (I), (b) a (meth)acrylate having not less than 10 carbon atoms, (c) 70-90 wt.% inorganic particles with respect to the whole resin film, (d) a curing catalyst, and (e) an organic solvent. The organic solvent is volatilized from the maleimide composition so as to obtain the maleimide resin film which is a solid and uncured resin film. A=tetravalent organic group having a cyclic structure(s); B'=an alkylene group that has not less than 6 carbon atoms and at least one aliphatic ring having not less than 5 carbon atoms, and may contain a hetero atom; Q=an arylene group that has not less than 6 carbon atoms, and may contain a hetero atom; W'=B' or Q; n=0 to 100; and m=0 to 100, provided that at least one of n or m is a positive number.