• 专利标题:   Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.
  • 专利号:   WO2023282592-A2, KR2023007862-A, WO2023282592-A3
  • 发明人:   SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K
  • 专利权人:   HANSOL CHEM CO LTD
  • 国际专利分类:   C09K005/08, C08J003/24, C08K003/04, C08K003/38, C08K009/12, C08L063/00, C08L091/04, C08K005/09
  • 专利详细信息:   WO2023282592-A2 12 Jan 2023 C09K-005/08 202314 Pages: 22
  • 申请详细信息:   WO2023282592-A2 WOKR009691 05 Jul 2022
  • 优先权号:   KR088688

▎ 摘  要

NOVELTY - Method for manufacturing a high-density heat dissipation composite includes: (i) melting and stirring an epoxy resin, a first phase change material, and a curing agent to form a mixture, and then firstly curing at a temperature equal to or higher than the curing temperature of the epoxy resin to form a matrix; and (ii) simultaneously performing secondary main curing and high-density compression processing on the product of step (i). USE - The method for manufacturing a high-density heat dissipation composite. The high-density heat dissipation composite is used for various components such as a housing material and an interface plate material of a component material that generates heat, and a heat control material of a battery system. ADVANTAGE - The method achieves hardening of a matrix and high-density compression processing simultaneously through an application of a hot press method, and produces a high-density heat dissipation composite which secures high latent heat, heat dissipation properties, and excellent leakage properties, and can be usefully applied under high temperature conditions. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a heat dissipation composite prepared by the above method, comprising a matrix formed by chemically bonding an epoxy resin and a first phase change material, and at least one of a second phase change material and a heat radiation filler dispersed in the matrix, and having a thickness of 0.1-5 mm and a density of 1 g/cm3or more.