▎ 摘　　要

NOVELTY - The pad (1) has a first silicone comprising polysiloxane having two vinyl groups as an adhesive portion for adhering the component to the inside of the device by being sandwiched between a component provided inside the device for forming a reactive gas atmosphere. A synthetic resin comprises a polymer and a second silicone polymer comprises polysiloxane or organohydrogen polysiloxane having silicon-hydrogen bond, and dispersed in the synthetic resin and alumina, boron nitride, graphite, graphene, carbon nanotubes, charcoal and ceramic particles selected from the group consisting of silicon carbide. USE - Gel pad for bonding silicon ring to electrostatic chuck in plasma etching device. ADVANTAGE - The gel pad has good adhesion between the electrostatic chuck and the silicon ring, and prevents arcing phenomenon that may occur at the location. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an internal structure of a plasma etching device and generation of plasma. 1Gel pad 20Electrostatic chuck 25Coupling ring 30Silicon ring 40Silicon wafer