• 专利标题:   Catalyst-free electroless plating of e.g. graphene, involves introducing composition containing nickel, iron, cobalt and/or copper precursor, to solution containing to-be-plated component, to set preset metal precursor concentration.
  • 专利号:   KR1932963-B1
  • 发明人:   KIM T H, LEE S B, JUNG B M, LEE K B
  • 专利权人:   KOREA INST MACHINERY MATERIALS
  • 国际专利分类:   C23C018/16, C23C018/48, C23C018/50
  • 专利详细信息:   KR1932963-B1 27 Dec 2018 C23C-018/16 201906 Pages: 20
  • 申请详细信息:   KR1932963-B1 KR019793 20 Feb 2018
  • 优先权号:   KR019793

▎ 摘  要

NOVELTY - Catalyst-free electroless plating method involves preparing a plating composition comprising a reducing agent and at least one metal precursor chosen from nickel precursor, iron precursor, cobalt precursor and copper precursor, and introducing the composition to a solution containing to-be-plated component, so that the concentration of the metal precursor becomes 0.0001-0.0054 M. USE - Catalyst-free electroless plating of to-be-plated component e.g. graphene, carbon nanotubes, carbon black, carbon fibers, glass fibers, polymer fibers or porous carbon material (all claimed). ADVANTAGE - The method enables efficient and economical catalyst-free electroless plating by simple process without requiring expensive precious metal catalyst. The wettability of the to-be-plated component is improved. Since catalyst is not required, the electroless plating can be performed in a single step without catalyst pretreatment.