▎ 摘　　要

NOVELTY - High temperature-resistant epoxy glass fiber insulating layer and mold pressing piece are made of composite materials by hot-press molding layer(s) of overlapped high-temperature-resistant epoxy alkali-free glass fiber-fabric prepreg, which is formed by impregnating alkali-free glass fiber-fabric with a high-temperature-resistant epoxy adhesive and baking the high-temperature-resistant epoxy alkali-free glass fiber-fabric prepreg with a semi-cured product on the alkali-free glass fiber-fabric. The alkali-free glass fiber-fabric is a mixture of greater than or equal to 2 of alkali-free glass fiber cloth, 7628 electronic grade alkali-free glass fiber cloth, high-strength alkali-free glass fiber cloth, alkali-free glass fiber checkered cloth and glass fiber smoldering treatment cloth. The high-temperature-resistant epoxy adhesive comprises 12-45 pts. wt. epoxy resin, 5-35 pts. wt. modified epoxy resin, 6-34 pts. wt. curing agent, 1-61 pts. wt. filler, 9.5-201 pts. wt. solvent and 0.01-0.18 pts. wt. accelerator. USE - The high temperature-resistant epoxy glass fiber insulating layer and mold pressing piece are used for high voltage motor, large generating set and power transformer field. ADVANTAGE - The high temperature-resistant epoxy glass fiber insulating layer and mold pressing piece are suitable in high temperature and ultra high voltage humidity environment for a long time, and have high temperature resistance, high moisture resistance, good performance and strong practicability. DETAILED DESCRIPTION - High temperature-resistant epoxy glass fiber insulating layer and mold pressing piece are made of composite materials by hot-press molding layer(s) of overlapped high-temperature-resistant epoxy alkali-free glass fiber-fabric prepreg, which is formed by impregnating alkali-free glass fiber-fabric with a high-temperature-resistant epoxy adhesive and baking the high-temperature-resistant epoxy alkali-free glass fiber-fabric prepreg with a semi-cured product on the alkali-free glass fiber-fabric. The alkali-free glass fiber-fabric is a mixture of greater than or equal to 2 of alkali-free glass fiber cloth, 7628 electronic grade alkali-free glass fiber cloth, high-strength alkali-free glass fiber cloth, alkali-free glass fiber checkered cloth and glass fiber smoldering treatment cloth. The high-temperature-resistant epoxy adhesive comprises 12-45 pts. wt. epoxy resin, 5-35 pts. wt. modified epoxy resin, 6-34 pts. wt. curing agent, 1-61 pts. wt. filler, 9.5-201 pts. wt. solvent and 0.01-0.18 pts. wt. accelerator. The epoxy resin is bisphenol fluorene epoxy resin, bis-o-cresol fluorene epoxy resin and/or bis-di-o-cresol fluorene epoxy resin. The modified epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, glycidyl amine epoxy resin, biphenyl epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, resorcinol epoxy resin, epoxy resin of dicyclopentadiene or dicyclopentadiene and phenolic polycondensation resin, isocyanate modified epoxy resin and/or hydantoin epoxy resin. The curing agent is a mixture of greater than or equal to 2 of 4,4-diaminodiphenylmethane, 4-diaminodiphenyl sulfone and diamine fluorene. The filler is aluminum hydroxide, aluminum oxide, boehmite, magnesium hydroxide, silicon micropowder, montmorillonite, kaolin, fumed silica, silicon dioxide micropowder, graphene, hydrotalcite and/or talc powder. The accelerant is 2-methylimidazole, 2-ethyl-4-methylimidazole, N-dimethylbenzylamine, boron trifluoride ethylamine, triethylamine, hexamethyltetramine and/or aluminum acetylacetonate. The solvent is toluene, xylene, ethylene glycol dimethyl ether, ethylene glycol ethyl ether acetate, propylene glycol methyl ether, methyl ethyl ketone, cyclohexanone, methyl acetate, butanone, acetone, N-dimethylformamide and/or ethanol. An INDEPENDENT CLAIM is included for preparation of the high temperature-resistant epoxy glass fiber insulating layer mold pressing piece comprising preparing high temperature-resistant epoxy adhesive by providing epoxy resin, modified epoxy resin, curing agent, filler, solvent, and accelerant; at room temperature, adding epoxy resin, modified epoxy resin and filler in a glue mixing tank, stirring for 0.5-2 hours at 55-115 degrees C, adding curing agent, stirring for 1-4 hours at 100-145 degrees C, adding solvent, dispersing uniformly, adding accelerant for adjusting the forming time of the glue solution, sampling, and using knife method to test the forming time of the glue solution, at 210 degrees C, when the forming time is 440-530 seconds, high temperature-resistant epoxy adhesive is prepared; preparing high temperature-resistant epoxy alkali-free glass fiber-fabric prepreg by coating the alkali-free glass fiber-fabric with the high temperature-resistant epoxy adhesive through a gluing machine, baking by drying tunnel of gluing machine, where the length of the drying passage of the gluing machine is 24 m and divided into 4 sections, where each section is 6 m, the baking temperature is 70-175 degrees C and the speed of the gluing machine is 8-21 m/minute, baking to obtain the high temperature-resistant epoxy alkali-free glass fiber-fabric prepreg, where the alkali-free glass fiber-fabric is alkali-free glass fiber cloth, 7628 electronic alkali-free glass fiber cloth, high-strength alkali-free glass fiber cloth, alkali-free glass fiber grid cloth, and/or glass fiber stewing treatment cloth; and cutting the high temperature resistant epoxy alkali-free glass fiber-fabric prepreg into a required shape and size according to the drawing requirements of the high temperature resistant epoxy glass fiber insulating layer and a molded part, placing layer(s) of the cut high temperature resistant epoxy alkali-free glass fiber-fabric prepreg on a stainless steel mold, sending the high temperature resistant epoxy alkali-free glass fiber-fabric prepreg into a hot press with a hot plate, controlling the temperature at 130-250 degrees C and pressure at 5-30 MPa for hot press molding, and determining the hot press molding time to be 0.5-30 hours according to the thickness of a molded structural part to be 0.2-150 mm, and obtaining the high temperature resistant epoxy glass fiber insulating layer and molded part.