▎ 摘　　要

NOVELTY - Preparation of oxidized graphene-modified LED thermally conductive potting adhesive comprises dispersing 1-7 pts. wt. nano graphene oxide in 100 pts. wt. vinyl polydimethylsiloxane and blending with 90-170 pts. wt. thermally conductive filler; adding 0.3-1.6 wt.% hydrogen-containing silicone oil crosslinking agent and crosslinking inhibitor and fully stirring; adding 1000-5000 ppm platinum catalyst and stirring; and mixing processed components. USE - Method for preparing oxidized graphene-modified LED thermally conductive potting adhesive (claimed) used for high thermal integrated electronic components, high-power LED chip, integrated circuit boards, and circuit modules. ADVANTAGE - The potting adhesive has thermal conductivity of 1.1-1.4 W/m and good mechanical performance and electric performance and can be solidified at normal temperature or by heating. DETAILED DESCRIPTION - Preparation of oxidized graphene-modified LED thermally conductive potting adhesive comprises dispersing 1-7 pts. wt. nano graphene oxide in 100 pts. wt. vinyl polydimethylsiloxane and blending with 90-170 pts. wt. thermally conductive filler; adding 0.3-1.6 wt.% hydrogen-containing silicone oil crosslinking agent and crosslinking inhibitor and fully stirring, where amount of base material is 100 pts. wt., amount of hydrogen-containing silicone oil is 0.2-45 pts. wt., amount of crosslinking inhibitor is 0.002-0.08 pt. wt.; adding 1000-5000 ppm platinum catalyst and stirring; and mixing processed components.