• 专利标题:   Semiconductor device, has metal layer provided above substrate with semiconductor element, and graphene layer including cross-sectional surface and extending in longitudinal direction, where metal layer includes convex shape on surface.
  • 专利号:   US2015325524-A1, US9437716-B2
  • 发明人:   WADA M, YAMAZAKI Y, KAJITA A, ISOBAYASHI A, SAITO T
  • 专利权人:   TOSHIBA KK, TOSHIBA KK
  • 国际专利分类:   H01L023/528, H01L023/532, B82Y030/00, C01B031/04, H01L029/66
  • 专利详细信息:   US2015325524-A1 12 Nov 2015 H01L-023/532 201578 Pages: 13 English
  • 申请详细信息:   US2015325524-A1 US803751 20 Jul 2015
  • 优先权号:   JP208669

▎ 摘  要

NOVELTY - The device has a metal layer (14) provided above a substrate (10) comprising a semiconductor element, where the metal layer includes convex shape on a cross-sectional surface and extends in a first longitudinal direction. A graphene layer (15) is provided on the metal layer to surround a side surface and an upper surface of a convex portion of the metal layer. The graphene layer includes a curved cross-sectional surface and extends in a second longitudinal direction, where the first longitudinal direction of the metal layer conforms to the second direction of the graphene layer. USE - Semiconductor device. ADVANTAGE - The device ensures that influence by edge scattering effect on resistance of a graphene end portion is reduced and a graphene wiring structure exhibiting low resistance even with minute wire width is realized. The device performs graphene quality enhancing process to easily attain electrical conduction and realize a low-resistance wire. The device ensures that height of a catalyst metal layer is increased and number of stack layers of the graphene sheets is increased to form a conduction path in a layer form and lower resistance. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a semiconductor device. Substrate (10) Interlayer insulating film (11) Metal layer (14) Graphene layer (15) Graphene wires (20)