▎ 摘　　要

NOVELTY - The package has support structure that is provided with electrical connection element on which light emitting chip is mounted. The electrical connection element is provided to connect light emitting chip and external terminal. An encapsulating material is provided to cover the light emitting chip. A protective film with graphene is equipped on the encapsulating material. USE - Light emitting device package. ADVANTAGE - The package can be effectively protected from external environment. The optical extraction efficiency and heat protection characteristic of the package can be improved. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the light emitting device package.