▎ 摘　　要

NOVELTY - Boron fiber reinforced epoxy resin plate forming and stress measuring, comprises e.g. modifying graphene by machine silane to form graphene powder, adding graphene powder to the acetone solution in batches, and placing in an ultrasonic machine to sonicate the mixed solution to prepare a uniformly dispersed suspension, mixing the epoxy resin and the polyamide resin according to the mass ratio of 5:3, preheating at 50 degrees C for 20 minutes, and reducing the viscosity to a certain degree, placing in a vacuum drying oven at 50 degrees C for 40 minutes under conditions to remove bubbles present in the epoxy resin and the polyamide resin, adding 10% by mass of acetone and 20% of dibutyl phthalate to the epoxy resin, mixing mixture evenly, pouring the carbon fiber into batches, adding curing agent, polyamide resin, stirring, shaken in an ultrasonic cleaner for 30 minutes, and finally placing in a vacuum drying oven at a temperature of 50 degrees C for 40 minutes to remove bubbles mixed in the stirring process. USE - The method is useful for boron fiber reinforced epoxy resin plate forming and stress measuring. ADVANTAGE - The plate has a larger modulus and a higher wear resistance, low density and high strength. DETAILED DESCRIPTION - Boron fiber reinforced epoxy resin plate forming and stress measuring, comprises (i) modifying graphene by machine silane to form graphene powder, (ii) adding graphene powder to the acetone solution in batches, and placing in an ultrasonic machine to sonicate the mixed solution to prepare a uniformly dispersed suspension, (iii) mixing the epoxy resin and the polyamide resin according to the mass ratio of 5:3, preheating at 50 degrees C for 20 minutes, and reducing the viscosity to a certain degree, placing in a vacuum drying oven at 50 degrees C for 40 minutes under conditions to remove bubbles present in the epoxy resin and the polyamide resin, adding 10% by mass of acetone and 20% of dibutyl phthalate to the epoxy resin, mixing mixture evenly, pouring the carbon fiber into batches, adding curing agent, polyamide resin, stirring, shaken in an ultrasonic cleaner for 30 minutes, and finally placing in a vacuum drying oven at a temperature of 50 degrees C for 40 minutes to remove the bubbles mixed in the stirring process to form a molten epoxy melt, (iv) adding the molten epoxy melt to the suspension, using a stirrer to slowly stir, and quickly stirring until the mixture is uniform to form a graphene epoxy resin composite liquid, (v) placing the boron fiber in the graphene epoxy resin composite liquid to fully infiltrate to form a slurry, (vi) burying the anode and the cathode in a diagonal position on the inner side wall of the plate making mold, leaving the terminal, (vii) pouring the slurry into the sheet making mold, and discharging the bubbles by vibration until the design thickness is reached, (viii) forming the slurry into a plate after three stages of gelation, solidification and maturation in the plate making mold, and the anode and the cathode are adhered to the plate and are integrally released from the plate, (ix) placing the sheet for a certain period of time, according to a certain supporting method, the loading pressure is applied to the sheet by the center loading method, the anode and the cathode are connected to the digital resistance meter, and the digital resistance meter measures the loading force and the resistivity curve, completing the plate pressure sensing calibration measurement, and (x) packaging the board.