▎ 摘　　要

NOVELTY - Heat-resistant phenolic resin-epoxy resin composite conductive glue comprises 40-200 pts. wt. epoxy resin, 10-100 pts. wt. phenolic resin, 0-20 pts. wt. plasticizer, 10-50 pts. wt. diluent, 50-90 pts. wt. flaky copper alloy, 10-50 pts. wt. spherical copper alloy, 0-10 pts. wt. graphene and 5-10 pts. wt. curing agent, where the flaky copper alloy and spherical copper alloy are both micron-sized, and the flaky copper alloy, spherical copper alloy and graphene are used as conductive filler. USE - Used as heat-resistant phenolic resin-epoxy resin composite conductive glue. ADVANTAGE - The conductive glue: overcomes disadvantage of low temperature and low resistance stability of epoxy conductive adhesive; utilizes conductive fillers with different morphologies, which are designed to promote strength and avoid weaknesses; and has excellent electrical conductivity, heat resistance and resistance stability. The method is simple and convenient to operate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing heat-resistant phenolic resin-epoxy resin composite conductive glue, comprising (i) adding mixture of epoxy resin and phenolic resin into a beaker, heating, stirring and mixing uniformly, (ii) orderly adding diluent and plasticizer to the beaker, ultrasonically vibrating and stirring for 10-30 minutes to obtain mixture having low viscosity, (iii) orderly adding flaky copper alloy, spherical copper alloy and graphene into the low-viscosity mixture, ultrasonically vibrating on water bath at 40-70 degrees C by stirring at a speed of 50-150 revolutions/minute for 10-30 minutes to obtain uniform conductive filler and resin mixture, (iv) cooling the conductive filler and resin mixture on cold water bath for 10-30 minutes, (v) adding curing agent to the cooled conductive filler and resin mixture while stirring to obtain mud-type semi-solidified substance, and (vi) placing mud-type semi-solidified substance in an oven, and curing at 60-90 degrees C for 1-5 hours to obtain final product.