• 专利标题:   Low-background conductive thermal embedding material for scanning electron microscope, comprises phenolic resin, conductive carbon medium and toughened carbon medium.
  • 专利号:   CN115353708-A
  • 发明人:   LEI J
  • 专利权人:   YUNNAN XIEYAN TECHNOLOGY CO LTD
  • 国际专利分类:   C08K003/02, C08K003/04, C08K007/06, C08L061/06, G01N023/2202, G01N023/2251, H01B001/24
  • 专利详细信息:   CN115353708-A 18 Nov 2022 C08L-061/06 202307 Chinese
  • 申请详细信息:   CN115353708-A CN11032694 26 Aug 2022
  • 优先权号:   CN11032694

▎ 摘  要

NOVELTY - A low-background conductive thermal embedding material comprises phenolic resin, conductive carbon medium and toughened carbon medium. USE - Low-background conductive thermal embedding material for scanning electron microscope used as surface analysis instrument for displaying internal structure of sample. ADVANTAGE - The embedding material has excellent electrical conductivity, suppressed serious charging effect and low element background, thus effectively improving the detection effect of samples, and is prepared by simple method. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of embedding material, which involves providing mixed additive liquid, adding each component into the additive liquid, stirring and mixing until all components are mixed evenly, drying, and crushing into powder.