▎ 摘　　要

NOVELTY - The structure has a substrate whose upper surface is electrically connected with a chip. A package colloid part is partially covered on a rear surface of the chip. A graphene layer is formed on the package colloid part and formed as a high-thermal conductive graphite film. The rear surface of the chip is partially covered with the graphene layer. Multiple switching elements are switched to supply external positive supply voltage to the chip. The package colloid part is matched with multiple exposed openings of the switching elements. USE - Semiconductor package structure. ADVANTAGE - The structure has high flatness coefficient and heat conductivity due to formation of the graphene layer so as to increase heat conduction uniformity in a heat-conducting side, and large heat exchange area, thus improving chip heat leading-out efficiency. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a semiconductor package structure.