▎ 摘　　要

NOVELTY - The apparatus has a bi-layer printed circuit board (100) which is provided with a through hole. A LED chip (110) is comprised of a parallel circuit. An upper portion of heat sink (200) is in contact with LED chip and lower portion of heat sink (200) is connected to heat sink (400). The pores are formed in a metal material. A graphene substrate (300) is provided to diffuse heat conducted from heat sink (200) to heat sink (400). The heat sink (400) is manufactured by metal foam of open cell type, and is connected to graphene substrate. USE - Heat radiating apparatus of LED lighting fixture. ADVANTAGE - The high heat generated from the LED chip heat dissipation port is quickly conducted and diffused into the heat dissipation device through the heat sink sintered with the highly thermal conductance, so that the heat radiation effect is maximized by natural convection. The thermal resistance of the stop element is minimized by maintaining adhesion and tightness maintenance of the mixing compound. DESCRIPTION OF DRAWING(S) - The drawing shows a side view of the heat radiating apparatus of LED lighting fixture. Bi-layer printed circuit board (100) Epoxy layer (101) LED chip (110) Heat sinks (200,400) Graphene substrate (300)