▎ 摘 要
NOVELTY - A low temperature curing conductive silver paste comprises 55-65 pts. wt. silver powder, 5-20 pts. wt. polymer resin, 0.2-1 pt. wt. curing agent, 0.1-5 pts. wt. thermosetting acrylic resin, 0.05-0.1 pt. wt. heat curing catalyst, 5-15 pts. wt. dispersant and 0.1-1 pt. wt. graphene. USE - Low temperature curing conductive silver paste (claimed). ADVANTAGE - The low temperature curing conductive silver paste is economical and reduces overlap resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low temperature curing conductive silver paste.