▎ 摘　　要

NOVELTY - The chip has a first bonding metal layer (4) provided with a P-type electrode (5). An N-type gallium nitride layer (8) is provided with an N- type electrode (9). A graphite substrate (2) is connected with a back metal layer (1). A second bonding metal layer (3) is provided with a graphite layer (10). The first bonding metal layer and the second bonding metal layer are made of gold, silver, copper, aluminum, titanium and nickel. The P-type electrode is made of molybdenum, nickel, palladium, magnesium, gold, silver or compound metal. USE - Vertical type graphene LED chip. ADVANTAGE - The chip is high in carrier mobility, and has improved luminous performance. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a vertical type graphene led chip. Back metal layer (1) Graphite substrate (2) Bonding metal layers (3, 4) P-type electrode (5) N-type gallium nitride layer (8) N- type electrode (9) Graphite layer (10)