▎ 摘　　要

NOVELTY - The device has a thermal grease layer (120) for directly contacting a processing unit (110). A heat pipe (130) comprises a heat pipe interior volume (132) with a working fluid (160). A device cover (140) is spaced from an exterior surface of the heat pipe by a distance from greater than 1 millimeter to about 5 millimeter. A bracket (150) includes a clamping portion (152) that holds the pipe by side exterior surfaces (138) of the pipe, where the portion does not extend past the exterior surface. The grease layer comprises a resin and a thermally conductive powder. The resin comprises an acrylic-based resin. The resin comprises an acrylic-based resin, natural rubber-based resin, styrene-butadiene rubber-based resin, styrenic block copolymer-based resin, silicone-based resin, epoxy resin, and polyurethane acrylate resin. The thermally conductive powder comprises copper, aluminum, graphite, graphene, aluminum nitride, boron nitride, beryllium oxide and silicon carbide. USE - Device for thermal managing of electronic device (claimed) such as laptop computer, tablet computer, workstation, smart phone or TV. ADVANTAGE - The thermal grease layer is provided with a thickness of 0.03-0.2 mm, and the clamping portion of the bracket is extended to the exterior surface of the heat pipe such that the bracket has a surface flush with the first exterior surface, and thus enables to increase the reliability of electronic devices and prevents the premature failure of the electronic devices, and also improves the heat transfer efficiency of the thermal management device. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: an electronic device; and a method for making an electronic device. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the thermal management device. 110CPU 120Thermal grease layer 130Heat pipe 132Interior volume 138Side exterior 140Device cover 150Bracket 152Clamping portion 160Working fluid