▎ 摘　　要

NOVELTY - Preparing compressible high flexibility high heat capacity phase change heat conducting interface material comprises (i) adding 30-50 pts. wt. phase change material, 15-30 pts. wt. olefin block copolymer and 10-20 pts. wt. plasticizer into the high temperature reaction kettle, stirring and melting, (ii) adding 10-25 pts. wt. alkane material into the high flexible high heat capacity phase change complex material, in the high temperature reaction kettle, (iii) adding 4-10 pts. wt. carbon material into the compressible high-flexibility high-heat capacity complex material, adding in the high temperature reaction kettle, stirring and mixing uniformly (iv) cooling the high temperature reaction kettle, continuously stirring and mixing uniformly, stopping stirring to obtain the product, and (v) placing the product into the mold, hot pressing and forming to obtain the compressible high-flexibility high heat capacity phase change interface heat conducting material. USE - Preparing compressible high flexibility high heat capacity phase change heat conducting interface material. ADVANTAGE - The prepared material has good compression performance, low surface hardness, can well fill the interface gap, reduces the heat contact, relieves the influence of the heat impact on the device, and is suitable for the heat management application of the small and medium-sized electronic device.