▎ 摘　　要

(CN212485303-U) NOVELTY - The utility model claims a thin film flip chip packaging structure and display device. The film flip chip package structure comprises a film substrate, a chip, a first radiating piece and an adhesive piece. The film substrate is provided with a first surface and a second surface opposite to the first surface. the chip is set on the first surface of the thin film substrate, and electrically connected with the thin film substrate. the first radiating piece is set on the first surface of the thin film substrate, and completely covers the chip, and the first radiating piece, the chip and the thin film substrate have a gap. the adhesive piece is set between the film substrate, the chip and the first radiating piece; and the adhesive piece fills the gap. The utility model has excellent radiating efficiency and structure reliability. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of the film-on-chip packaging structure. 1Film-on-chip packaging structure 11Thin film substrate 12Chip 13First heat sink 14Adhesive element 121Contact surface D1First direction D3Third direction S1First surface S2Second surface