▎ 摘　　要

NOVELTY - The utility model claims an electronic chip packaging structure, comprising a rubber sleeve, the rubber sleeve is provided with a mounting groove, the inner side of the mounting groove is equipped with a heat conducting plate, the heat conducting plate is equipped with a circuit board, the circuit board is equipped with a chip, the chip; the heat conducting plate and the circuit board are provided with heat conducting silicone grease; the heat conducting silicone grease is provided with a radiating plate. the chip and the circuit board pass through the radiating plate; the radiating fin, the heat conducting plate, and heat dissipation pore graphene radiating layer can improve the radiating effect; the chip and the circuit board through the rubber sleeve, radiating plate, heat conducting plate and heat conducting silicone grease can effectively protect it to avoid damage in the transportation process.