▎ 摘　　要

NOVELTY - A component carrier (1) comprises a stack comprising at least one electrically insulating layer structure (2) and/or at least one electroconductive layer structure (3), a heat removing and electroconductive base structure (4), a component connected to the base structure so as to at least partially protrude from the base structure and so as to be laterally at least partially covered by an electrically insulating material of the stack, and an electroconductive top structure on or above a top main surface of the component. USE - Carrier used for components e.g. electronic component, electrically non-conductive and electroconductive inlay, heat transfer unit, light guiding element, optical element, bridge, energy harvesting unit, active electronic component, passive electronic component, electronic chip, storage device, filter, integrated circuit, signal processing component, power management component, optoelectronic interface element, voltage converter, cryptographic component, transmitter, receiver, electromechanical transducer, actuator, microelectromechanical system, microprocessor, capacitor, resistor, inductance, accumulator, switch, camera, antenna, magnetic element, and logic chip (all claimed). ADVANTAGE - The component carrier has excellent oxidation and corrosion resistance, high routing density, and effective thermal management with high vertical currents flow. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for (1) Manufacture of component carrier. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the component carrier. Component carrier (1) Electrically insulating layer structure (2) Electroconductive layer structure (3) Base structure (4) Core (9)