▎ 摘　　要

NOVELTY - A substrate processing device comprises a process chamber with processing space for processing substrate, and substrate support for supporting the substrate with constant power. The substrate comprises a main component and a dielectric layer which are bonded by adhesive. The adhesive comprises an additive material which is coated by a thermally conductive filler. USE - Device used for processing substrate for display device and semiconductor device. ADVANTAGE - The substrate processing device has excellent heat resistance, thermal conductivity and mechanical property. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the adhesive for substrate processing equipment, which comprises a base material and additive material coated with thermal conductive filler.