▎ 摘　　要

NOVELTY - System for thermally cutting a graphene-containing layer comprises a graphene layer part lining the bottom part of the system. A substrate layer is distributed on the graphene layer. A heat absorbing layer forms a lining at the bottom of the graphene layer. A heat absorbing material is set at the bottom of the graphene layer and substrate layer to carry out heat treatment of the substrate layer. USE - The system is useful for thermally cutting graphene-containing layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for thermally cutting the graphene-containing layer, comprising: (i) arranging the graphene layer in the substrate layer which is provided at least one heat absorbing layer for absorbing the heat during thermal cutting of graphene; (ii) carrying out heat treatment on the graphene layer, and transferring the heat from the substrate layer to the absorbing layer during the process of cutting, and preventing the destruction of the periphery of graphene structure by the heat of the heat conducting layer; and (iii) radiating heat from the substrate layer and/or graphene layer to the heat absorbing layer, and obtaining graphene. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the system for thermally cutting graphene-containing layer.