▎ 摘　　要

NOVELTY - Preparing oxidation resistant bonded copper wire material comprises e.g. (i) purifying the raw material of the copper wire, using vacuum furnace, drawing the furnace into a vacuum and melting the raw material copper into high purity copper having purity greater than 99.95%, (ii) adding the melted copper solution into the zinc powder and the manganese powder, and uniformly stirring the mixed solution until the zinc powder and the manganese powder are fusing with the copper solution, (iii) cooling and allowing the mixed solution to stand for 30-60 minutes until the mixed solution is in an alloy state, (iv) placing the alloyed state mixture in a copper wire, making mold for rough drawing treatment, annealing the copper rough wire at 480 degrees C for 40-60 minutes, and (v) placing the rough drawing state copper wire in an argon atmosphere to achieve the purpose of primary reduction, introducing the hydrogen gas into the argon gas container, discharging the argon gas. USE - The method is useful for preparing oxidation resistant bonded copper wire material. ADVANTAGE - The method solves the problem of anti-oxidation layer bonding copper wire, and detaches for long time. DETAILED DESCRIPTION - Preparing oxidation resistant bonded copper wire material comprises (i) purifying the raw material of the copper wire, using vacuum furnace, drawing the furnace into a vacuum and melting the raw material copper into high purity copper having purity greater than 99.95%, (ii) adding the melted copper solution into the zinc powder and the manganese powder, and uniformly stirring the mixed solution until the zinc powder and the manganese powder are fusing with the copper solution, (iii) cooling and allowing the mixed solution to stand for 30-60 minutes until the mixed solution is in an alloy state, (iv) placing the alloyed state mixture in a copper wire, making mold for rough drawing treatment, annealing the copper rough wire at 480 degrees C for 40-60 minutes, (v) placing the rough drawing state copper wire in an argon atmosphere to achieve the purpose of primary reduction, introducing the hydrogen gas into the argon gas container, discharging the argon gas, passing the hydrogen gas through the pretreatment bonding copper wire for further reduction treatment, and reducing the bonded copper wire to oxygen-free copper, (vi) tinning the surface of the oxygen-free copper, wrapping tin on the surface of the copper, and maintaining for 20 minutes, (vii) fine wire drawing and subjecting annealing treatment, further wire-bonding the bonded copper wire, where the wire diameter is 0.1-0.5 mm, subjecting annealing treatment at 480 degrees C for 40-60 minutes, and (viii) spraying the graphene liquid on the surface of the bonded copper, drying and applying the antiseptic oil and cooling for 20 minutes.