• 专利标题:   Heat dissipation module for integrated electronic devices used in automobiles, comprises heat source and heat dissipation layer is provided for dissipating heat from heat source with heat sink provided on heat dissipation layer.
  • 专利号:   KR2021060131-A, KR2293022-B1
  • 发明人:   KIM K S, CHOI D Y
  • 专利权人:   KOREA INST IND TECHNOLOGY
  • 国际专利分类:   B32B015/04, H05K007/20
  • 专利详细信息:   KR2021060131-A 26 May 2021 H05K-007/20 202146 Pages: 9
  • 申请详细信息:   KR2021060131-A KR147795 18 Nov 2019
  • 优先权号:   KR147795

▎ 摘  要

NOVELTY - The heat dissipation module comprises a heat source (100). A heat dissipation layer (200) is provided for dissipating heat from the heat source. A heat sink (300) is provided on the heat dissipation layer. The heat dissipation layer includes a photo-sintered metal-nanocarbon composite. The content of nano-carbon in the composite is less than 3 percent by weight based on the total weight of the metal. The heat dissipation layer is photo-sintered by irradiating light to the nano-carbon paste after a metal paste is applied to one surface of the heat source and a nano-carbon paste is applied on the metal paste. The metal is selected from silver, copper, nickel, gold, tin, and aluminum. The nano-carbon is selected from the carbon nanotubes, graphene, fullerene, and diamond. USE - Heat dissipation module for integrated electronic devices used in automobiles. ADVANTAGE - The heat dissipation module has excellent thermal conductivity as a photo-sintered metal-nano composite heat dissipation layer is applied. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of heat dissipation module for integrated electronic devices used in automobiles.