▎ 摘　　要

NOVELTY - Preparing high thermal conductive insulating substrate material comprises e.g. dissolving silane coupling agent in ethanol solution to dilute, adding dried filler alumina and silicon micropowder, stirring in a water bath magnetically, allowing to stand for cooling, filtering, drying and crushing to obtain surface-treated filler, heating acetone solution in water bath, soaking in carbon fiber, washing with water, drying to obtain dewatered carbon fiber, concentrating nitric acid solution, ultrasonically shaking, washing with water, drying to obtain surface-treated dewatered carbon fiber and mixing with nickel-plated carbon nanotubes, mixing graphene coated copper powder, aluminum nitride and organic silica gel, pouring into kneading machine, kneading and taking out into a mold, pressing, taking out into vacuum drying oven, heating and solidifying, demolding to obtain graphene coated copper powder-aluminum nitride thermal conductive material, mixing cyanate monomer and epoxy resin. USE - The high thermal conductive insulating substrate material is useful for PCB filled with graphene coated copper powder (claimed). DETAILED DESCRIPTION - Preparing high thermal conductive insulating substrate material comprises dissolving silane coupling agent in ethanol solution to dilute, adding dried filler alumina and silicon micropowder, stirring in a water bath magnetically, allowing to stand for cooling, filtering, drying and crushing to obtain surface-treated filler, heating acetone solution in water bath, soaking in carbon fiber, washing with water, drying to obtain dewatered carbon fiber, concentrating nitric acid solution, ultrasonically shaking, washing with water, drying to obtain surface-treated dewatered carbon fiber and mixing with nickel-plated carbon nanotubes, mixing graphene coated copper powder, aluminum nitride and organic silica gel, pouring into kneading machine, kneading and taking out into a mold, pressing, taking out into vacuum drying oven, heating and solidifying, demolding to obtain graphene coated copper powder-aluminum nitride thermal conductive material, mixing cyanate monomer and epoxy resin, heating and melting, adding surface treatment filler, dispersing evenly, injecting into mold, vacuuming, removing bubble after curing process and mixing with graphene-coated copper powder-aluminum nitride thermal conductive material.