• 专利标题:   Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.
  • 专利号:   CN113543524-A, CN113543524-B
  • 发明人:   ZHENG K, CAO X, YE G, ZHANG J, MA Y
  • 专利权人:   CHINESE ACAD SCI CHEM INST
  • 国际专利分类:   C25D005/54, H05K003/42
  • 专利详细信息:   CN113543524-A 22 Oct 2021 H05K-003/42 202213 Chinese
  • 申请详细信息:   CN113543524-A CN10293788 15 Apr 2020
  • 优先权号:   CN10293788

▎ 摘  要

NOVELTY - A method for treating substrate surface involves (1) pre-washing a surface of a substrate to be electroplated, and (2) coating the prepared graphene dispersion liquid on the pre-washed substrate surface to be electroplated in step (1) to form a conductive layer for direct electroplating, where the graphene dispersion comprises water, graphene and macromolecular dispersant, and the graphene and macromolecular dispersant are in a conjugated system. USE - Method for treating substrate surface for electroplating flexible circuit board (claimed). ADVANTAGE - Since the graphene dispersion has fewer layers of graphene components, a thinner and denser conductive layer is formed. According to the processing method, the conductive layer has the flexibility of adjustable thickness and position. The graphene dispersion liquid has excellent uniformity, and the conductive layer formed by subsequent surface treatment has stable property and excellent compactness.