• 专利标题:   Thermally conductive sheet for semiconductor element, has polymer adhesive layer arranged on upper surface of substrate, where thermal conductivity of sheet is higher than about specific value.
  • 专利号:   TW202239935-A
  • 发明人:   LEE K, YU C
  • 专利权人:   VECTOR FLUX TECHNOLOGY CO LTD
  • 国际专利分类:   C09K005/14
  • 专利详细信息:   TW202239935-A 16 Oct 2022 C09K-005/14 202327 Pages: 29 Chinese
  • 申请详细信息:   TW202239935-A TW111972 31 Mar 2021
  • 优先权号:   TW111972

▎ 摘  要

NOVELTY - A thermal conductive sheet includes a substrate and a polymer adhesive layer. The material of the substrate includes metal, metal oxide, metal nitride, non-metal nitride, metal carbide, non-metal carbide, metal boride, non-metal boride, fullerene, graphene, carbon fiber, diamond, diamond powder, ceramic, or combinations thereof, wherein the thermal conductivity of the substrate is higher than about 20W/mK. The polymer adhesive layer is disposed on an upper surface of the substrate. The thermal conductivity of the thermal conductive sheet is higher than about 10W/mK.