▎ 摘　　要

NOVELTY - Directly plating circuit board based on graphene film comprises e.g. heating graphene oxide containing a specific functional group at 700-950 degrees C under a nitrogen or argon atmosphere for 0.5-1 hour, dispersing the heat-treated graphene oxide in an aqueous solution containing polyethyleneimine under ultrasonic agitation, ultrasonically stirring for 12-24 hours, and washing by centrifugation to obtain polyethyleneimine-graphene oxide (PEI-GO), uniformly mixing the PEI-GO, the polymer monomer and solvent, carrying out the reaction at 250-300 degrees C, and centrifuging to obtain the graphene oxide-polymer composite, dispersing the graphene oxide-polymer composite in an ethanol solution, and adding a proton conductive polymer to obtain a film forming stock solution of the graphene oxide-polymer composite, after the circuit board subjecting to grinding, de-soiling and degreasing treatment, washing the circuit board surface by high-pressure jet water, vibrating the circuit board at the same time. USE - The method is useful for directly plating circuit board based on graphene film. ADVANTAGE - The method is simple and environmentally friendly, mild and short operations method. DETAILED DESCRIPTION - Directly plating circuit board based on graphene film comprises (i) heating the graphene oxide containing a specific functional group at 700-950 degrees C under a nitrogen or argon atmosphere for 0.5-1 hour, dispersing the heat-treated graphene oxide in an aqueous solution containing polyethyleneimine under ultrasonic agitation, ultrasonically stirring for 12-24 hours, and washing by centrifugation to obtain polyethyleneimine-graphene oxide (PEI-GO), uniformly mixing the PEI-GO, the polymer monomer and the solvent, carrying out the reaction at 250-300 degrees C, and centrifuging to obtain the graphene oxide-polymer composite, (ii) dispersing the graphene oxide-polymer composite in an ethanol solution, and adding a proton conductive polymer to obtain a film forming stock solution of the graphene oxide-polymer composite, (iii) after the circuit board subjecting to grinding, de-soiling and degreasing treatment, washing the circuit board surface by high-pressure jet water, vibrating the circuit board at the same time, and filling the circuit board hole with moisture to remove the moisture of the circuit board surface, (iv) diluting the graphene oxide-polymer composite film forming stock solution into a working liquid in a specific auxiliary agent, vibrating the circuit board to form uniform graphene oxide in the board surface and the polymer composite serosa, drying to form a conductive film, removing the floating powder on the surface of the conductive film by pickling with sulfuric acid, performing the second drying and closing to obtain a circuit board covered with a conductive film, and (v) placing the circuit board covered with the conductive film in a sulfuric acid solution for activation treatment, placing the circuit board coated with the conductive film after the activation treatment in the plating solution to set the plating parameters under vibration, rocking and pumping operations, and performing electroplating.