▎ 摘　　要

NOVELTY - Separating a composite sheet (20) which includes an atomically thin material and a substrate, comprises applying hypersonic waves to the composite sheet so as to separate the atomically thin material from the substrate. USE - The method is useful for separating a composite sheet to separate an atomically thin material from a substrate (claimed) such as copper, where the atomically thin material is graphene. ADVANTAGE - The method: eliminates the need for a liquid phase etch, rinse, retrieval, and drying process that can introduce defects and imperfections in an atomically thin material such as a graphene sheet; is environmentally friendly as no copper waste solution, or other substrate material waste is generated and the copper sheet that remains after the separation process can be recycled for other uses or re-used to grow another graphene sheet on it; is easily scalable, requires little power and is tunable to accommodate for bond strength variations from temperature, pressure, and other factors; ensures repeatable separation of the graphene layer from the copper sheet; and utilizes the hypersonic source that can be adapted to separate other atomically thin materials from an associated substrate material. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a method (M1) for separating an atomically thin material from a substrate, comprising providing a composite sheet which has an atomically thin layer bonded to a substrate, determining a bond energy (24) value between the atomically thin material and the substrate, determining a spatial derivative value of the bond energy value, determining an equilibrium displacement valve from the spatial derivative value and applying an excitation frequency to the composite sheet which is greater than the equilibrium displacement value; and (2) a system for separating an atomically thin material from a substrate, comprising a hypersonic wave source positioned proximal either the atomically thin material or the substrate so as to generate hypersonic waves to separate the atomically thin material from the substrate. DESCRIPTION OF DRAWING(S) - The figure shows a schematic representation of a process for separating an atomically thin material and a substrate from each other. Copper sheet (10) Graphene sheet (18) Composite sheet (20) Bond (24) Hypersonic source (30)