• 专利标题:   Preparation method of high heat dissipation integrated inductor, involves forming continuous second heat conducting layer, and forming electrode on inductor semi-finished product formed with second heat conductive layer.
  • 专利号:   CN113889322-A
  • 发明人:   WANG J, WU C, WANG W, MA F, LIN T, QIAN J, SUN H, XU K
  • 专利权人:   JIANGSU LINEPRINTING NEW MATERIAL TECHNO
  • 国际专利分类:   H01F027/22, H01F027/28, H01F041/02, H01F041/06
  • 专利详细信息:   CN113889322-A 04 Jan 2022 H01F-027/22 202220 Chinese
  • 申请详细信息:   CN113889322-A CN11163374 30 Sep 2021
  • 优先权号:   CN11163374

▎ 摘  要

NOVELTY - The method comprises (i) preparing and forming a magnetic core comprising a blade swing and a magnetic column, where the magnetic column is connected with upper surface of the blade swing, and coil is wound on the magnetic column, (ii) performing first coating of heat conducting material on each surface of the magnetic core around the coil, forming a continuous first heat conducting layer; (iii) adding magnetic powder in the magnetic core to perform hot press molding and sintering and curing to form a magnetic powder layer on the periphery of the magnetic column, so as to obtain an inductor semi-finished product, (iv) performing second coating of heat conducting material on outer surface of the inductor semi-finished product, forming a continuous second heat conducting layer, and (v) forming an electrode on the inductor semi-finished product formed with the second heat conducting layer, so as to form the integrated inductor. USE - Preparation method of high-radiating integrated inductor (claimed). ADVANTAGE - The radiating ability of the product is greatly improved. The internal overheating caused by the deterioration of the inductance performance is prevented, since the heat is transported to the surface of product in inductance working process. The high heat dissipation integrated inductance is achieved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a high heat dissipation integrated inductor. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of a high-heat-dissipation integrated inductor. Magnetic core (1) Coil (2) First heat conducting layer (3) Magnetic powder layer (4) Second heat conducting layer (5) Leaf pendulum (11) Magnetic column (12)