▎ 摘　　要

NOVELTY - Preparing thermally conductive resin comprises (1) adding soluble yttrium source into aqueous ammonia, (2) uniformly mixing aluminum nitride powder, graphene oxide-based yttrium oxide composite material, ammonium polyacrylate, acrylamide, N,N'-methylenebisacrylamide and deionized water, (3) soaking the ceramic skeleton in a mixed solvent of heptadecafluorodecyltriethoxysilane and absolute ethanol, and (4) uniformly mixing epoxy resin and 4-methylhexahydrophthalic anhydride, then adding 2-ethyl-4-methylimidazole, continuing to uniformly mix to obtain the epoxy resin mixture, vacuumizing the modified ceramic skeleton and epoxy resin mixture respectively, then under vacuum conditions at 80-90°C, soaking the modified ceramic skeleton in the epoxy resin mixture, increasing the air pressure, after the epoxy resin mixture fills the pores, taking out the composite material and curing to obtain thermally conductive resin. USE - The method is useful for preparing thermally conductive resin, which is used in electronic packaging, electronic appliance technology in recent years, integrated density of electronic component and device is higher and higher, and the volume is continuously reduced. ADVANTAGE - The method efficiently overcomes the defects of poor dispersibility and easy agglomeration of the oxidation and graphene oxide, and improves the heat-conducting performance and mechanical property of the ceramic material. It uses seventeen fluorine decyl triethoxysilane to hydrophobically modify the ceramic framework, improving the interface compatibility of the filler and the substrate to reduce the interface thermal resistance, and improving the heat conducting performance of the material. 17Fluoromethane has long bond length, molecular rotation has large degree of freedom, and the other side group is methyl, non-polar group, the force between molecules is weak, exhibits good elasticity, can adapt to the external stress change by deformation, and improves the anti-bending performance of material. DETAILED DESCRIPTION - Preparing thermally conductive resin comprises (1) adding soluble yttrium source into aqueous ammonia, stirring and uniformly mixing, then adding graphene oxide and sodium dodecyl sulfate, uniformly dispersing by ultrasonic, carrying out hydrothermal reaction, after the reaction is finished, performing suction filtration, washing, drying, and then calcining at 600-650°C for 2-3 hours to obtain graphene oxide-based yttrium oxide composite material, (2) uniformly mixing aluminum nitride powder, graphene oxide-based yttrium oxide composite material, ammonium polyacrylate, acrylamide, N,N'-methylenebisacrylamide and deionized water, obtaining the mixed material, ball milling the mixed material, vacuum degassing, then adding ammonium persulfate aqueous solution and N,N,N',N'-tetramethylethylenediamine, demolding after injection molding, drying and calcining to obtain ceramic skeleton, (3) soaking the ceramic skeleton in a mixed solvent of heptadecafluorodecyltriethoxysilane and absolute ethanol, stirring at room temperature for 2-3 hours, then washing and drying to obtain the modified ceramic skeleton, and (4) uniformly mixing epoxy resin and 4-methylhexahydrophthalic anhydride, then adding 2-ethyl-4-methylimidazole, continuing to uniformly mix to obtain the epoxy resin mixture, vacuumizing the modified ceramic skeleton and epoxy resin mixture respectively, then under vacuum conditions at 80-90°C, soaking the modified ceramic skeleton in the epoxy resin mixture, increasing the air pressure, after the epoxy resin mixture fills the pores, taking out the composite material and curing to obtain thermally conductive resin. An INDEPENDENT CLAIM is also included for thermally conductive resin prepared by the above preparation method.