▎ 摘　　要

NOVELTY - High thermal conductive adhesive comprises 30-50 pts. wt. graphene particles, 10-15 pts. wt. aliphatic polyamide, 20-28 pts. wt. organic silica gel, 4-8 pts. wt. alpha -cyanoacrylate, 20-30 pts. wt. adhesive base, 3-5 pts. wt. polyisobutylene and 10-12 pts. wt. acrylic monomer. USE - As high thermal conductive adhesive (claimed). ADVANTAGE - The high thermal conductive adhesive has excellent bonding capacity, stability, wear resistance and high temperature resistance, and is non-toxic and environmentally-friendly. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for method of preparing high thermal conductive adhesive, which involves adding above-mentioned components into double planetary mixer, stirring mixture for 60-90 minutes, molding mixture using twin-roll forming machine, and curing molded product for 3-8 minutes using UV radiation.