• 专利标题:   Formation of nano dots for forming charge trap layer used in fabrication method of memory device, involves forming cores, coating surfaces of cores with polymer, and thermally treating coated surfaces of cores to form graphene layer.
  • 专利号:   US2009101964-A1, JP2009099982-A, KR2009039229-A, US8748968-B2, JP5596283-B2, KR1463064-B1
  • 发明人:   CHOI J, SHIN H, YOON S, CHOI J Y, SHIN H J, YOON S M
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   B01J019/00, B05D003/00, G11B011/105, H01L021/336, H01L029/792, H01L021/8247, H01L027/115, H01L029/788, H01L021/20, B82Y010/00
  • 专利详细信息:   US2009101964-A1 23 Apr 2009 H01L-021/336 200930 Pages: 17 English
  • 申请详细信息:   US2009101964-A1 US081357 15 Apr 2008
  • 优先权号:   KR104734

▎ 摘  要

NOVELTY - Surfaces of cores (C1) are coated with a polymer, and the polymer coated surface of cores is thermally-treated, to form a graphene layer (C2) covering the surfaces of cores. USE - Formation of nano dots used for forming charge trap layer used in fabrication method of non-volatile memory device (both claimed) such as dynamic random access memory used for storing data. ADVANTAGE - The nano dots are formed efficiently on the surface of cores. The non-volatile memory device including charge trap layer containing nano dots has improved reliability and can be operated efficiently even at high temperature. DETAILED DESCRIPTION - Surfaces of cores are coated with a polymer, and the polymer coated surface of cores is thermally-treated, to form a graphene layer covering the surfaces of cores. Thus, the formation method of nano dots is performed. The cores include metal particles for trapping charge and to function as graphitization catalyst. The thermal treatment of cores is carried out in presence of inert atmosphere or in reduced atmosphere. The core is formed on a substrate. The metal is chosen from nickel, cobalt, iron, platinum, gold, aluminum, chromium, copper, magnesium, manganese, molybdenum, rhodium, silicon, tantalum, titanium, tungsten, uranium, vanadium and zirconium. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of semiconductor memory device. Substrate (40) Impurity region (42,44) Tunneling layer (46) Charge trap layer (48) Nano dots (48a) Blocking layer (50) Gate electrode (52) Core (C1) Graphene layer (C2) Gate structure (GS)