▎ 摘　　要

NOVELTY - The material has a graphene film provided with a fold region, where the fold region comprises folding structures. The fold region is fixed with a hollow portion. A protection film is arranged on a surface of a flat area. The protection film comprises polyethylene terephthalate, polyvinylidene fluoride, polyimide and polycarbonate. An elastomer material comprises thermoplastic polyurethane and silica gel. USE - Heat dissipation material for an electronic device. ADVANTAGE - The material realizes excellent thermal conductivity by utilizing the graphene film so as to effectively improve heat dissipation performance of the heat dissipation material, thus improving heat dissipation performance of an electronic device. The graphene film is provided the folding region so as to improve bending resistance of the heat dissipation material. The hollow portion relieves stress of the heat dissipation material during bending process, improves service life of the heat dissipation material and improves utilizing convenience of the heat dissipation material in the electronics device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a heat dissipation material manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a side view of a heat dissipation material.