▎ 摘　　要

NOVELTY - Low temperature bonding method based on hydrophobic copper micron layer comprises (i) adding the mixture into the indium plating solution, where the mixture includes electrolyte, polyethylene glycol, janus green B and chloride ions, (ii) placing the copper micro-needle layer in the indium plating solution containing the mixture for electroplating, forming a pine-shaped micro-nano indium layer on the surface of the copper micro-needle layer and obtaining a substrate with a pine-shaped copper indium secondary micro-nano indium layer, and evenly covering the graphene, (iii) coating the pine-shaped copper indium secondary micro-nano indium layer with graphene and relatively arranging the tin-silver-copper alloy solder ball on the ultrasonic bonding instrument to forms a contact area with the tin-silver-copper alloy solder ball and (iv) bonding the pine-shaped copper indium secondary micro-nano indium layer coated with graphene with the tin-silver-copper alloy solder ball. USE - The method is useful for low temperature bonding method based on hydrophobic copper micron layer. ADVANTAGE - The method avoids direct contact between copper and tin, delays the growth of copper-tin compounds, low bonding temperature, reduces the bonding pressure is, the bonding time, realizes transient bonding, improves the reliability of bonding interconnection, bonding does not require a protective atmosphere, and saves energy consumption. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the low temperature bonding method based on hydrophobic copper micron layer.