• 专利标题:   Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.
  • 专利号:   CN115305542-A
  • 发明人:   MIAO H, ZHU K
  • 专利权人:   SHENNAN CIRCUIT CO LTD
  • 国际专利分类:   C25D015/00, C25D017/00, C25D021/10, C25D005/10, C25D005/18, C25D005/54, C25D005/56
  • 专利详细信息:   CN115305542-A 08 Nov 2022 C25D-005/54 202310 Chinese
  • 申请详细信息:   CN115305542-A CN10899767 28 Jul 2022
  • 优先权号:   CN10899767

▎ 摘  要

NOVELTY - The method involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in a first plating liquid without forced convection to perform first-plating with a first preset current density. The surface of the nano- metal conductivity object is covered to form a first-layer plating layer. The non-material plating pieces are placed after the first-plate plating in a second plating solution of a second-plated solution of the second-pressure convection in the second preset current denser to perform a second plating. A second layer of plating is formed on a surface of a first layer, where the second current density is greater than the first current density. USE - Electroplating method for non-metal plating with surface absorbed with nano metal conductive material such as carbon black, graphite, graphene and conductive polymer such as polypyridine. ADVANTAGE - The method ensures realizing the surface absorbing nano metal conductive material of the insulating material for electroplating, so that the insulator material plating quality can be improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electroplating device for non-metal plating with surface absorbed with nano metal conductive material.