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  • 专利标题:   Electronic paste for preparing thick film circuit chip heat source, comprises solid phase component and organic solvent carrier at weight ratio, where solid phase component comprises graphene or graphene oxide and rare earth oxide.
  • 专利号:   CN107396466-A
  • 发明人:   WANG K, WANG C
  • 专利权人:   WANG K, WANG C
  • 国际专利分类:   H05B003/10, H05B003/22
  • 专利详细信息:   CN107396466-A 24 Nov 2017 H05B-003/10 201781 Pages: 14 Chinese
  • 申请详细信息:   CN107396466-A CN10532724 03 Jul 2017
  • 优先权号:   CN10532724

▎ 摘　　要

NOVELTY - An electronic paste comprises solid phase component and organic solvent carrier at a weight ratio of 65-90:35-10, where the solid phase component comprises graphene or graphene oxide and rare earth oxide. USE - Electronic paste for preparing thick film circuit chip heat source (claimed). ADVANTAGE - The electronic paste improves the radiating performance and the mechanical strength of the thick film circuit, and has heat resistance, chemical resistance and heat conductivity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) a method for preparing an electronic paste (2) a thick film circuit chip heat source (3) a method for preparing a thick film circuit chip heat source.