▎ 摘　　要

NOVELTY - A calcium sulfate whisker dispersion enhanced high thermal conductivity aluminum nitride-silicon carbide composite circuit board substrate material comprises 60-70 pts. wt. aluminum nitride, 15-20 pts. wt. silicon carbide, 8-10 pts. wt. calcium sulfate whisker, 1-2 pts. wt. graphene oxide, 10-12 pts. wt. quaternary ammonium ionic liquid, 1-2 pts. wt. KH550 (RTM: ( gamma )-aminopropyltriethoxysilane), 4-5 pts. wt. 1,6-hexanediol, 1-1.5 pts. wt. polyethylene glycol, 6-8 pts. wt. sintering aid, and certain amount of ethanol. USE - Calcium sulfate whisker dispersion enhanced high thermal conductivity aluminum nitride-silicon carbide composite circuit board substrate material (claimed). ADVANTAGE - The calcium sulfate whisker dispersion enhanced aluminum nitride-silicon carbide composite circuit board substrate material has low surface tension, excellent wettability, dispersion ability, degumming and sintering stability, and thermal insulation property, high strength, toughness, and thermal conductivity, and is prepared with high yield. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of calcium sulfate whisker dispersion enhanced high thermal conductivity aluminum nitride-silicon carbide composite circuit board substrate material.