▎ 摘　　要

NOVELTY - Water-soluble resin composition comprises aqueous polyolefin, water-soluble high molecular polymer, aqueous photoinitiator, adhesion promoter, auxiliary agent, deionized water and filler. USE - The composition is useful for forming laser etching protective film on a semiconductor element substrate (all claimed). ADVANTAGE - The composition: exerts the synergistic effect of multi-component mixed resin; forms protective film having excellent heat resistance, low shrinkage under laser irradiation, high permeability, and low surface roughness; utilizes semiconductor substrates with uneven structure having no gaps; has high absorption rate for deep ultraviolet light with a wavelength less than 355 nm, and clear formed edge of the opening; easily removes protective film; has low energy consumption; can be cleaned up in one scan without residue; and is environmentally friendly, and particularly suitable for laser etching on the surface of semiconductor concave-convex substrates. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) preparing the water-soluble resin composition, comprising mixing aqueous polyolefin and water-soluble high molecular polymer, uniformly stirring at high speed, then adding adhesion promoter, auxiliary agent, deionized water, and filler, continuously stirring and dispersing at high speed; and (2) eliminating the water-soluble resin composition of laser etching protective film, comprising removing the protective film by laser radiation etching.