▎ 摘　　要

NOVELTY - The thin encapsulating mounting structure has a first thin film portion (101) having two surfaces and a second thin film portion (301) having two surfaces. A fixing portion (201) is provided between the first thin film portion and the second thin film portion. One of the surfaces of the first thin film portion is partially or fully fixed to the fixing portion. One of the surfaces of the second thin film portion is partially or completely fixed to the fixing portion. The fixing portion is a binder consisting of at least one of epoxy resin, silicone resin, polyester, polyurethane, nanosilicate or nanotitanium. The thickness range of the fixing portion is 0.5-100 microns. The first thin film portion, the fixing portion and the second thin film portion are assembled to form a thin encapsulating mounting structure main portion with thickness of less than or equal to 200 microns. USE - Thin encapsulating mounting structure for evaporation and heat dissipation of electronic component, thin heat-dissipation plate, and heat-dissipating flexible plate. ADVANTAGE - The holding space allows the electronic chip components to be accommodated to enable covering of the electronic chip components. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the thin encapsulating mounting structure. 101,301First and second thin film portions 201Fixing portion 401Holding space