▎ 摘　　要

NOVELTY - Cooling of semiconductor component involves (s1) arranging a metal layer between the semiconductor component and a heat dissipation coating layer, (s2) forming the heat dissipation coating layer by using a heat dissipation coating composition comprising a urethane binder resin and thermally conductive particles, and (s3) exfoliating the thermally conductive particles comprising at least one of graphene nanoplates (GNP) and graphene, by milling expanded graphite for 2-6 hours. USE - Cooling of semiconductor component such as semiconductor chip, heat sink, heat dissipation fin, and case of semiconductor chip (all claimed) for controlling heat. Uses include but are not limited to CPU, access point, graphics processing unit, and solid state drive. ADVANTAGE - The method enables cooling of semiconductor component having excellent dissipation effect. The heat dissipation film is capable of reducing the temperature rise due to heat generation of the semiconductor component. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a heat dissipation film for the semiconductor component, which comprises an adhesive layer, the metal layer positioned on the upper surface of the adhesive layer, and the heat dissipation coating layer positioned on the upper surface of the metal layer.