• 专利标题:   Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.
  • 专利号:   CN116180179-A
  • 发明人:   JING W, LI B, LI R, LI F, WU Q, PAN G
  • 专利权人:   SHENZHEN BEIJIA ELECTRONIC MATERIAL CO
  • 国际专利分类:   C25D007/00, C25D009/04, H05K003/42
  • 专利详细信息:   CN116180179-A 30 May 2023 C25D-009/04 202354 Chinese
  • 申请详细信息:   CN116180179-A CN11475601 23 Nov 2022
  • 优先权号:   CN11475601

▎ 摘  要

NOVELTY - Coating solution comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, pH regulator and water. The surface energy auxiliary agent comprises a non-ionic double-sub surfactant and an anion surfactant. The condensing agent is removed after catalyzing the reaction of the edge-modified graphene and the high molecular polymer. USE - The coating solution is useful for hole metallization of a printed circuit board (claimed) and direct electroplating. ADVANTAGE - The coating solution has good dispersing ability and conductive ability, good adaptation printing circuit board, and good fluidity, improved through-hole capability of the groove liquid of the high aspect ratio circuit board and small influence on the viscosity of the modified graphene solution for edge direct plating with better fluidity and multiple supporting point and set of hydrophilic functional groups to combine with the graphene particles with electrostatic force, or further matches with condensing agent to directly modify the edge modified graphene to increase the space steric hindrance between the edge-modified graphene and maintain the dispersion stability of the surface energy auxiliary agent. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing coating solution.