▎ 摘　　要

NOVELTY - Preparation of heat conducting gasket comprises providing raw materials comprising phase change material, heat conducting filler, matrix material and crosslinking agent, where ratio of axial length and radial length of heat conducting filler is greater than 1, mixing raw materials at a first temperature which is greater than the melting point of phase change material and less than the boiling point of phase change material, performing curing crosslinking reaction of matrix material in presence of crosslinking agent to form a matrix at crosslinking density of 0.5-5%, obtaining a preform, and freezing preform at a second temperature which is less than the melting point of phase change material and temperature difference reaches more than 30degrees Celsius to obtain heat conducting gasket. An included angle between axial direction of heat conducting filler in heat conducting gasket and surface of heat conducting gasket is 60-90degrees. USE - The method is for preparing heat conducting gasket used for electronic products (claimed). ADVANTAGE - The heat conducting gasket has excellent heat conducting performance and high temperature conformality. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of heat conduction conductive gasket.