• 专利标题:   Graphene foam zero wrapping mold used in electronic device, comprises forming die located below stamping die, forming die provided with placement groove corresponding to extruding groove, push plate elastically fitted in placement groove, and extruding groove elastically fitted with top plate.
  • 专利号:   CN115674647-A
  • 发明人:   LI G, CHENG X, FANG R, HU T
  • 专利权人:   DONGGUAN HENGYI ELECTRONIC TECHNOLOGY CO, WUHAN HANXI TECH CO LTD
  • 国际专利分类:   B29C033/30, B29C051/30, B29C051/44
  • 专利详细信息:   CN115674647-A 03 Feb 2023 B29C-051/30 202318 Chinese
  • 申请详细信息:   CN115674647-A CN11305536 24 Oct 2022
  • 优先权号:   CN11305536

▎ 摘  要

NOVELTY - The mold comprises a forming die (2) located below the stamping die (1). Multiple positioning rods (3) are installed on the lower side of the stamping die. The upper side of the forming die is provided with positioning grooves (4) corresponding to multiple positioning rods. The stamping die is provided with an extruding groove. The forming die is provided with a placement groove corresponding to the extruding groove. A push plate (5) is elastically fitted in the placement groove. The extruding groove is elastically fitted with a top plate. USE - Graphene foam zero wrapping mold used in electronic device. ADVANTAGE - The mold: is convenient for the user to plug in the positioning rod and the positioning slot, locates the position between the stamping die and the forming die, improves the efficiency of material wrapping, is convenient for users to take out materials, and further improves the efficiency of material wrapping. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing process of graphene foam zero wrapping mold. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the graphene foam zero wrapping mold. 1Stamping die 2Forming die 3Multiple positioning rods 4Positioning grooves 5Push plate