▎ 摘　　要

NOVELTY - The chip has heat-dissipating holes (5) that are evenly arranged at the middle position of the top of a thermally conductive metal layer (1). The bottom of the thermally conductive metal layer is provided with a chip main layer (2). A base (3) is provided at the bottom of the chip main layer. The bottom of the base is evenly provided with connecting pins (4). A circuit board is provided at an intermediate position inside the chip main layer. A mounting groove is provided in the middle of one end of the back side of the chip main layer. The first electromagnet is provided at one end of the inner side of the installation slot. The second electromagnet is provided at one end of the first electromagnet away from the installation slot. A limit block is provided at a middle position on the back side of the chip main layer far away from the mounting groove. The first metal terminal is provided at an intermediate position inside the limit block. USE - Semiconductor refrigeration graphene chip. ADVANTAGE - The single chip performs calculation and the other chip is in a trim standby state, thus prolonging the service life of the chip, while reducing heat generation. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the semiconductor refrigeration graphene chip. Thermally conductive metal layer (1) Chip main layer (2) Base (3) Connecting pin (4) Heat-dissipating hole (5)