▎ 摘　　要

NOVELTY - Graphene/copper/micron particle composite material comprises micron particles, copper element and graphene, The copper element covers part or all of the surface of the micron particles, the graphene covers the outer surface of the copper element. USE - The graphene/copper/micron particle composite material is useful in graphene high-temperature heating ink: for high-temperature heating bodies for electronic cigarette lighters, kettles, bakeware, heaters and electric ceramic stove, for high-temperature heating plates for industrial ovens and tunnel furnaces, and for high-temperature heating elements for high-temperature heating tubes (all claimed). ADVANTAGE - The graphene/copper/micron particle composite material: produces graphene high-temperature heating ink having resistivity upto 0.001 Ohm. cm, which has excellent conductivity, easy dispersion, high dosage, can withstand temperature up to 500-700degrees Celsius, has excellent thermal conductivity, high temperature stability, and suitable under high temperature conditions for long time. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) Preparing graphene/copper/micron particle composite material, comprising (1) preparing copper sulfate solution, dispersing the micron particles uniformly into the copper sulfate solution, (2) taking out the micron particles with solid copper sulfate adsorbed on the surface, drying, heating to obtain the micron particles with copper oxide adsorbed on the surface, (3) heating the micron particles with copper oxide adsorbed on the surface in a reducing gas atmosphere to obtain the micron particles with copper element adsorbed on the surface, (4) heating the micron particles with copper element adsorbed on the surface under a reducing gas atmosphere and/or a protective gas atmosphere, and then introducing a carbon source gas to generate graphene on the surface to obtain fianl product; (2) Graphene high temperature heating ink, comprising 2-60 pts. wt. graphene/copper/micron particle composite material, 20-95 pts. wt. silicone resin, 10-50 pts. wt. diluent, 0.01-0.1 pt. wt. defoamer, 0.1-1 pt. wt. leveling agent and 0.1-1 pt. wt. dispersant.