• 专利标题:   Chemical composite plating solution useful for preparing composite chemical plating layer, comprises nickel salt, reductive agent, complexing agent, surfactant, molybdate, cerium oxide powder and graphene.
  • 专利号:   CN114855151-A
  • 发明人:   DAI M, SHI Q, LIN S, SU Y, TANG P, HUANG S, WEI C
  • 专利权人:   GUANGDONG ACAD SCI NEW MATERIALS INST
  • 国际专利分类:   C23C018/18, C23C018/50
  • 专利详细信息:   CN114855151-A 05 Aug 2022 C23C-018/50 202288 Chinese
  • 申请详细信息:   CN114855151-A CN10498063 09 May 2022
  • 优先权号:   CN10498063

▎ 摘  要

NOVELTY - Chemical composite plating solution comprises 20-40 g/l nickel salt, 20-50 g/l reductive agent, 45-120 g/l complexing agent, 0.5-25 mg/l surfactant, 0.02-0.1 g/l molybdate, 5-20 g/l cerium oxide powder and 10-250 mg/l graphene. The complexing agents comprises an organic complexing agent and an inorganic complexing agent. The surfactant comprises anionic surfactant and nonionic surfactant. USE - The chemical composite plating solution is useful for preparing a composite chemical plating layer, which is useful in a surface of a component to improve abrasion resistance, high temperature anti-oxidant wide temperature domain wear-resistant performance and corrosion resistance. ADVANTAGE - The chemical composite plating solution has good dispersibility, good stability, fast plating speed and wide application range, and provides chemical composite coating with excellent corrosion resistance, high temperature anti-oxidant wide temperature domain wear-resistant performance and abrasion resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: a preparation method of chemical composite plating solution; a preparation method of chemical composite plating layer; and a chemical composite plating layer.