▎ 摘　　要

NOVELTY - The method involves forming a heat radiating surface with film material. A resin coating layer is arranged on an outside surface of a graphene layer. Heat radiating membrane material is covered on an outside surface of LED core particle. White ink is mixed with coating fluorescent powder. Heat radiating film material manufacturing process is performed. Graphite alkene sealing process is performed. An LED chip is fixed with a thin graphene film. LED chip covering process is performed. USE - LED chip packaging method. ADVANTAGE - The method enables utilizing the thin graphene film to increase thermal conductivity and light transmittance efficiency of the LED chip and increasing LED heat radiating performance. DESCRIPTION OF DRAWING(S) - The drawing shows a flow diagram illustrating an LED chip packaging method. '(Drawing includes non-English language text)'