▎ 摘　　要

NOVELTY - The utility model claims a fast heating semiconductor welding wire hot pressing plate, comprising: a hot pressing plate main body and a heating plate set below the hot pressing plate main body, the heating plate comprises a first insulating layer stacked in order, a heating body, a second insulating layer, a conductive bonding layer and a soaking plate, the soaking plate is adhered under the hot pressing plate through the first high temperature resistant double faced adhesive tape; one side of the hot pressing plate main body is provided with a first heating liquid hole and a second heating liquid hole, the other side of the hot pressing plate main body is provided with a first liquid outlet hole and a second liquid outlet hole; between the first heating liquid hole and the first liquid outlet hole is fixedly connected with a first heating pipe, the second heating liquid hole and the second liquid outlet hole are fixedly connected with a second heating pipe, the first heating pipe and the second heating pipe are located in the hot pressing plate main body, two sides of the hot pressing plate main body are fixedly connected with a plurality of locating bolts, the locating bolt located on the same side of the hot pressing plate main body is fixedly connected with a heat insulating layer, each heat insulating layer is fixedly connected with a plurality of mounting blocks.