• 专利标题:   Flexible circuit board comprises functionalized graphene-based ink layer attached to the surface of flexible plastic substrate, and deposited copper layer deposited to the surface of functionalized graphene-based ink layer.
  • 专利号:   CN111031664-A
  • 发明人:   GU G, ZHANG G, LAI Z
  • 专利权人:   BGT MATERIALS LTD
  • 国际专利分类:   H05K001/09, H05K003/12, H05K003/18
  • 专利详细信息:   CN111031664-A 17 Apr 2020 H05K-001/09 202040 Pages: 11 Chinese
  • 申请详细信息:   CN111031664-A CN11176176 10 Oct 2018
  • 优先权号:   CN11176176

▎ 摘  要

NOVELTY - Flexible circuit board comprises a functionalized graphene-based ink layer attached to the surface of a flexible plastic substrate according to the pattern of the conductive traces of a circuit, and a deposited copper layer deposited to the surface of the functionalized graphene-based ink layer. USE - Used as flexible circuit board. ADVANTAGE - The flexible circuit board: uses functionalized graphene-based ink as a catalyst for electroless copper plating; does not uses hexavalent chromium and palladium as catalysts; is environmentally friendly and economical; uses functionalized graphene-based ink, which has excellent adhesion and is more flexible; can reliably adhere to the surface of the flexible plastic substrate and act as an adhesive between the deposited copper and the flexible plastic substrate. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing flexible circuit board comprising preparing functional graphene-based ink layer by printing the functionalized graphene-based ink on the surface of a flexible plastic substrate to form a pattern of conductive traces of the circuit through a screen printing process, drying the functionalized graphene-based ink on the surface of the flexible plastic substrate at 60-200 degrees C, soaking the flexible plastic substrate with the functionalized graphene-based ink on the surface in a chemical plating solution to form a layer of deposited copper on the surface of the functionalized graphene-based ink through an electroless copper plating process. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the flexible circuit board.